NETZSCH - Leading Thermal Analysis.
 
 
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Micromet Series

 
 

The NETZSCH Epsilon Series is the leading line of in-process DEA cure monitoring instrumentation for the thermosetting polymer processing industry. Over 500 dielectric cure monitoring systems are used worldwide in R&D, QA/QC, process monitoring and process control applications involving thermosetting resins, composites, paints, and coatings.

 

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Dielectric Sensors

Dielectric Cure Monitoring

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NETZSCH offers instruments for thermal analysis, thermal properties measurement, thermal hazard screening, and contract testing services. Our portfolio is the world's broadest, including a full range of dilatometers to measure high accuracy thermal expansion, classical DSC & TGA, high temperature DSC to 1650°C for specific heat, very high temperature STA (TGA-DSC/DTA) from sub-ambient to 2400°, thermal / evolved gas analysis with fully-integrated FTIR & MS, high resolution TMA and DMA, plus DEA - dielectric analysis for thermoset cure monitoring. We also feature leading-edge technology for thermal conductivity by guarded hot plate and heat flow meters, laser flash thermal diffusivity measurement, thermal hazard screening via adiabatic reaction calorimetry, as well as refractories testing including HMOR, CIC, and RUL. Finally, we offer advanced software packages including thermokinetics for process modeling and development.

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Last update: 04/22/2009 , Copyright © 2000-2006 NETZSCH-Geraetebau GmbH