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Micromet Series

 

 

 

The Micromet Series is the leading line of in-process cure monitoring instrumentation for the thermosetting polymer processing industry. Over 500 Micromet dielectric cure monitoring systems are used worldwide in R&D, QA/QC, process monitoring and process control applications involving thermosetting resins, composites, paints, and coatings.

 

Micromet

Products

Dielectric Sensors

Dielectric Cure Monitoring

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NETZSCH offers precision thermal analysis instruments including advanced dilatometers (with a new basic R&D/QC dilatometer), classical DSC & TGA (with a new economical DSC), high temperature DSC to 1650°C for specific heat, very high temperature STA (TGA-DSC/DTA) to 2400°C (featuring the new STA 409-PC Luxx®), thermal / evolved gas analysis with fully-integrated FTIR & MS, plus high resolution TMA and DMA. We also feature leading technology for thermal conductivity and diffusivity measurement as well as refractories testing including HMOR, CIC, and RUL.

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Last update: 04/25/2008 , Copyright © 2000-2006 NETZSCH-Geraetebau GmbH